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PCB & SMT


Specification:

  • Layer: 4L

  • Board Thickness: 1. 6mm

  • Surface Treatment: Electroplated Gold 5u"





Specification:

  • Layer: 10L

  • Board Thickness: 1. 6mm

  • Surface Treatment: Chemical Gold 3u"




Specification:

  • Layer: 12L

  • Board Thickness:1. 4mm

  • Surface Treatment: Chemical Gold 3u"




Specification:

  • Layer : 48L

  • Board size(inch) : 22.898 " × 16.898 "

  • Material: Megtron6

  • Finish thickness : 6.35 mm

  • Laminate (Megtron6) : 12oz “ THK

  • Process type : Immersion Gold (5u")

  • Fabrication : CNC +

  • Via in pad : Epoxy

  • Min. hole size: 0.3 mm

  • Impedance control: Yes


FPC SMT

  • Layer: 2L

  • Material: EMI, SUS Reinforcement, Impedance





FPC

  • Layer: 2L

  • Material: FR-4 Reinforcement,One pcs


SMT


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